Structural Integrity Assessment of IC Packaging Using Scanning Acoustic Microscopy (Arizona State Univ., Fraunhofer IMWS)

A new technical paper titled “Recent Progress in Structural Integrity Evaluation of Microelectronic Packaging Using Scanning Acoustic Microscopy (SAM): A Review” was published by researchers at Arizona State University and Fraunhofer Institute for Microstructure of Materials and Systems IMWS. Abstract “Microelectronic packaging is crucial for protecting, powering, and interconnecting semiconductor chips, playing a critical role... » read more
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