AFM-Based Protocol for Characterizing the Incipient Stages of Plasticity on Hybrid Bonding-Ready Copper Pads (NIST, Intel, Colorado School of Mines)

A new technical paper titled “Probing the Nanoscale Onset of Plasticity in Electroplated Copper for Hybrid Bonding Structures via Multimodal Atomic Force Microscopy” was published by researchers at the National Institute of Standards and Technology, Intel, and Colorado School of Mines. Excerpt  “The slowdown of Moore’s law has elicited a paradigm shift whereby shrinking of... » read more
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